by Jim Harrison
Molex (www.molex.com) will inhabit booth 109 at DesignCon 2013, January 28 – 31, 2013, Santa Clara, CA. Product Demonstrations include NeoScale, shown by Adam Stanczak, product development manager, and Vivek Shah, senior electrical engineer. The high-speed mezzanine connector delivers pristine signal integrity at 28 Gbits/s+ data rates.
Pete Soupir, product development manager, will be demonstrating the new Impel backplane technology operating at 25 Gbits/s over 3 different channel lengths using a reference backplane. The output will illustrate the Impel connector performance in-channel using Megtron 6 and HVLP board material with respective transmit and receive daughtercards.
Many other connector technologies will be on display.