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Monthly Archives: April 2009

IC Manage Releases Global Design Management Survey Results

IC Manage Inc. (a company that provides next generation design management solutions for IC design) today announced the availability of its “Global IC Design Management Report” covering the results of a 412 respondent survey of IC design professionals.  

The Impact of Streamlining, New Media and Strategic Collaborations in the Electronic Components Industry

 Global economic uncertainty remains the single greatest factor affecting recent trends in electronic components distribution. We see the bottom-line effects of this all over the world, in the form of a continued decline in industry-wide sales. North America has been hardest hit, followed by the United Kingdom, mainland Europe and Asia. Certain regions are also [...]

Is the Future Bright for LED Replacement Light Bulbs?

Will we ever see an LED light bulb that can satisfactorily replace energy-wasting incandescent bulbs?   Last September, I wrote about the US Department of Energy (DoE) ENERGY STAR program to develop “user- acceptable” LED-based alternatives to incandescent lighting (see “Getting It Right the Second Time”). The DoE is determined not to repeat the past [...]

NEC Electronics America at 2009 SAE World Congress

NEC Electronics America announced today it will be participating in four sessions at the 2009 SAE World Congress, April 20-23, at the Cobo Center in Detroit. The technical presentations will address advanced electronics solutions in several application areas: active safety technologies for vision-based safety systems; flexible CPU architectures for single- and multi-core applications; in-vehicle connectivity; [...]

Win a Free “LTE and the Evolution to 4G Wireless Design and Measurement Challenges” Book

Agilent Technologies  is offering the chance to win a copy of its new “LTE and the Evolution to 4G Wireless Design and Measurement Challenges” book. One hundred copies of the 450-page reference book, valued at $100 will be given away. It is an extremely valuable reference tool for LTE design teams worldwide.  The offer is [...]

ON Semiconductor expands application specific IC offering

ON Semiconductor announced the further expansion of its ASIC offering through an agreement with LSI Corporation which gives ON Semiconductor customers access to an established and cost-effective 110 nm process technology and associated silicon-proven IP via ON Semiconductor’s wafer fabrication facility in Gresham, Oregon.

Green is Worth the Price

With dollars being tight these days, one question on consumers’ minds when it comes to buying green is, “Is it worth the price?” Interestingly, a study recently came to my attention that indicates, when it comes to energy-efficient electronics, the answer is yes.