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Category Archives: Product News

Altera announces new products

Monday, April 15, 2013

by Jim Harrison Altera has announced an upcoming FPGA product line base on flash memory and using a 55nm TSMC process. Vince Hu, VP of marketing, made this announcement along with a few others, at a Globalpress Connection event. The new FPGAs will not need external program load and will target medium density, low cost [...]

Also filed in ICs & Discrete Semis, Technology News | | Comments (0)

Need some recipe suggestions for Raspberry Pi

Friday, December 21, 2012

So, recently, our friends at Newark / element14 were kind enough to send over a complete Raspberry Pi kit for us to tinker with. ^This is what a full Raspberry Pi kit looks like straight out of the box (hard to believe this is a full computer here)^ We’ve covered most of the basics surrounding [...]

Also filed in Boards & Peripherals, Contributed Posts, ICs & Discrete Semis, Opinion, Packaging & Connectors, Software/Development Tools, Technology News | Tagged , , , , , , , , , , | Comments (1)

Now you can make energy harvesting to go

Sunday, October 7, 2012

<i>by Paul O’Shea</i> It was really just a matter of time and now it has happened – three companies  (Energy Micro, Linear Technology, and Wurth Elektronik) got together to develop a product to make it easy to develop an energy harvesting application for just about anything you want (such as solar, electromagnetic, piezo-electric or thermal [...]

Also filed in Contributed Posts, ICs & Discrete Semis, Industry News, Power Sources | Tagged , , , , , , , , , | Comments (0)

Though Apple be small she is fierce

Wednesday, September 12, 2012

By Paul O’Shea Okay, I took some liberty with Shakespeare’s A Midsummer Night’s Dream – but it still holds true that for a company with only 47,000 employees (compare that to 220,000 for Samsung) it has mindboggling impact on the market. It has financial impact like few others – ahead of the iPhone 5 announcement [...]

Also filed in Contributed Posts, ICs & Discrete Semis, Industry News, Optoelectronics, Packaging & Connectors, Passive Components, Power Sources, Sensors & Transducers, Technology News | Tagged , , , , , | Comments (0)

Cool stuff at IMS2012 – a quick walk through the floor

Tuesday, June 19, 2012

 By Christina Nickolas A quick walk through the floor before my meetings show some interesting products and technologies. Valtronic Technologies caught my attention with a sceleton which had attached circuits on it, showing that the company produces implanted circuits for medical applications.                                                                                It is only 9:15 and Agilent seems to have a [...]

Also filed in Technology News, Trade Shows, Uncategorized | | Comments (0)

IMS2012 exhibitions start today – here are some devices to see

Tuesday, June 19, 2012

By Christina Nickolas Here is a brief taste of what exhibitors plan to showcase on the IMS2012 floor. AWR (booth#1514) will be showcasing the Analyst – 3D EM technology for bumps, bond wires, tapered vias and more – as well as its latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for [...]

Also filed in Electromechanicals, ICs & Discrete Semis, Industry News, Opinion, Software/Development Tools, Technology News, Test & Measurement, Trade Shows | Tagged | Comments (0)

DRIE is becoming more popular

Tuesday, May 15, 2012

By Christina Nickolas A new report from Yole Développement predicts that the number of wafer processed with DRIE will see 5x growth over 2011 – 2017, see figure below. Originally used for MEMS, the Deep Reactive Ion Etching (DRIE) is a structuration process which enables achieving etch depths of 100s of micrometers with almost vertical sidewalls with very high [...]

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