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Category Archives: Packaging & Connectors

Molex showing off new connectors at DesignCon

Friday, January 18, 2013

by Jim Harrison Molex (www.molex.com) will inhabit booth 109 at DesignCon 2013, January 28 – 31, 2013, Santa Clara, CA. Product Demonstrations include NeoScale, shown by Adam Stanczak, product development manager, and Vivek Shah, senior electrical engineer. The high-speed mezzanine connector delivers pristine signal integrity at 28 Gbits/s+ data rates. Pete Soupir, product development manager, [...]

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Need some recipe suggestions for Raspberry Pi

Friday, December 21, 2012

So, recently, our friends at Newark / element14 were kind enough to send over a complete Raspberry Pi kit for us to tinker with. ^This is what a full Raspberry Pi kit looks like straight out of the box (hard to believe this is a full computer here)^ We’ve covered most of the basics surrounding [...]

Also filed in Boards & Peripherals, Contributed Posts, ICs & Discrete Semis, Opinion, Product News, Software/Development Tools, Technology News | Tagged , , , , , , , , , , | Comments (1)

Though Apple be small she is fierce

Wednesday, September 12, 2012

By Paul O’Shea Okay, I took some liberty with Shakespeare’s A Midsummer Night’s Dream – but it still holds true that for a company with only 47,000 employees (compare that to 220,000 for Samsung) it has mindboggling impact on the market. It has financial impact like few others – ahead of the iPhone 5 announcement [...]

Also filed in Contributed Posts, ICs & Discrete Semis, Industry News, Optoelectronics, Passive Components, Power Sources, Product News, Sensors & Transducers, Technology News | Tagged , , , , , | Comments (0)

iPhone app helps optimize heat sinks to cooling needs

Wednesday, January 4, 2012

By Paul O’Shea Once again, smart phones prove their worth – having the power of anything at your fingertips – all you need is the app installed on your smart mobile device. Advanced Thermal Solutions developed a heat sink design calculator, as an iPhone app, that identifies the proper heat sinks to solve most component-level [...]

Also filed in Electromechanicals, ICs & Discrete Semis, Software/Development Tools, Technology News, Uncategorized | Tagged , , , , , , , , , | Comments (0)

Metcase offering unique 19-in. enclosures to North America

Wednesday, March 30, 2011

Metcase, the metal enclosures division of OKW Enclosures, recently signed an agreement with Retex, the Spanish manufacturer of 19-in. racks and cabinets, to market its product line in North America. Since many U.S. companies have offered such equipment in the U.S. for many years, Metcase wanted to have a unique proposition in entering the Market. [...]

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Are nanocarbons the next big thing?

Friday, February 11, 2011

According to a recent report from iRAP, Inc. (www.innoresearch.net), they are. In the February 2011 report, “ET-113: Production and Application of Carbon Nanotubes, Carbon Nanofibers, Fullerenes, Graphene and Nanodiamonds: A Global Technology Survey and Market Analysis” iRAP predicts that nanocarbon product production will triple by 2015. Known for their versatile electrical and mechanical properties, nanocarbon [...]

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Heads up: Molex at DesignCon ’11

Monday, January 24, 2011

If you’re headed to DesignCon (January 31 – February 3 in Santa Clara, CA) this year, be sure to stop by booth #501 and check out the latest additions to Molex’s Impact connector system. The Impact Orthogonal direct connectors and the Impact Plus 85-Ohm backplane connectors both feature increased data rates and other enhancements for [...]

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